cov
Nyob rau hauv lub tshav pob ntawm semiconductor manufacturing, uas nrhiav qhov kawg precision, lub coefficient ntawm thermal expansion yog ib tug ntawm cov tseem ceeb tsis muaj feem xyuam rau cov khoom zoo thiab ntau lawm stability. Thoob plaws hauv tag nrho cov txheej txheem los ntawm photolithography, etching mus rau ntim, qhov sib txawv ntawm thermal expansion coefficients ntawm cov ntaub ntawv tuaj yeem cuam tshuam nrog kev tsim khoom ntawm ntau txoj hauv kev. Txawm li cas los xij, lub hauv paus granite, nrog nws cov thermal expansion coefficient ultra-low, tau dhau los ua tus yuam sij los daws qhov teeb meem no. cov
Lithography txheej txheem: Thermal deformation ua rau cov qauv sib txawv
Photolithography yog cov kauj ruam tseem ceeb hauv kev tsim khoom semiconductor. Los ntawm lub tshuab photolithography, cov qauv hauv Circuit Court ntawm lub npog ntsej muag raug xa mus rau saum npoo ntawm wafer coated nrog photoresist. Thaum lub sijhawm txheej txheem no, kev tswj xyuas thermal hauv lub tshuab photolithography thiab kev ruaj ntseg ntawm lub rooj ua haujlwm yog qhov tseem ceeb heev. Siv cov khoom siv hlau tsoos ua piv txwv. Lawv coefficient ntawm thermal expansion yog kwv yees li 12 × 10⁻⁶ / ℃. Thaum lub sijhawm ua haujlwm ntawm lub tshuab photolithography, cov cua sov tsim los ntawm lub teeb pom kev laser, lub teeb pom kev zoo thiab cov khoom siv kho qhov muag yuav ua rau cov cuab yeej ntsuas kub ntawm 5-10 ℃. Yog tias lub tshuab lithography lub rooj ua haujlwm siv lub hauv paus hlau, lub hauv paus 1-meter ntev yuav ua rau kev nthuav dav deformation ntawm 60-120 μm, uas yuav ua rau muaj kev hloov pauv ntawm qhov txheeb ze ntawm lub npog ntsej muag thiab wafer. cov
Hauv cov txheej txheem tsim khoom siab heev (xws li 3nm thiab 2nm), qhov sib txawv ntawm transistor tsuas yog ob peb nanometers. Xws li ib tug me me thermal deformation yog txaus los ua rau cov qauv photolithography yuav misaligned, ua rau txawv txav transistor kev twb kev txuas, luv circuits los yog qhib circuits, thiab lwm yam teeb meem, ncaj qha ua rau lub chip functions tsis ua hauj lwm. Lub thermal expansion coefficient ntawm granite puag yog tsawg li 0.01μm / ° C (piv txwv li, (1-2) × 10⁻⁶ / ℃), thiab deformation nyob rau hauv tib lub kub hloov tsuas yog 1/10-1/5 ntawm cov hlau. Nws tuaj yeem muab cov khoom lag luam ruaj khov rau lub tshuab photolithography, kom ntseeg tau qhov hloov pauv ntawm cov qauv photolithography thiab txhim kho cov txiaj ntsig ntawm kev tsim cov nti. cov
Etching thiab deposition: cuam tshuam qhov tseeb qhov tseeb ntawm tus qauv
Etching thiab deposition yog cov txheej txheem tseem ceeb rau kev tsim cov qauv peb-dimensional Circuit Court ntawm lub wafer nto. Thaum lub sij hawm etching txheej txheem, cov roj reactive muaj cov tshuaj tiv thaiv nrog cov khoom nto ntawm lub wafer. Lub caij no, cov khoom xws li RF fais fab mov thiab roj ntws tswj hauv cov cuab yeej tsim kom muaj cua sov, ua rau qhov kub thiab txias ntawm cov wafer thiab cov khoom siv hluav taws xob nce. Yog hais tias lub coefficient ntawm thermal expansion ntawm lub wafer carrier los yog cov khoom puag tsis sib xws ntawm cov wafer (cov coefficient ntawm thermal expansion ntawm silicon cov khoom yog kwv yees li 2.6 × 10⁻⁶ / ℃), thermal stress yuav raug generated thaum kub hloov, uas tej zaum yuav ua rau me me tawg los yog warping ntawm lub wafer. cov
Hom deformation no yuav cuam tshuam rau qhov etching qhov tob thiab qhov verticality ntawm sab phab ntsa, ua rau qhov ntev ntawm cov etched grooves, los ntawm qhov thiab lwm yam qauv rau deviate los ntawm cov qauv tsim. Ib yam li ntawd, nyob rau hauv cov txheej txheem nyias zaj duab xis deposition, qhov sib txawv ntawm thermal expansion yuav ua rau muaj kev ntxhov siab nyob rau hauv cov ntaub ntawv nyias nyias, ua rau muaj teeb meem xws li tawg thiab tev ntawm zaj duab xis, uas cuam tshuam rau cov hluav taws xob kev ua tau zoo thiab kev cia siab ntev ntawm cov nti. Kev siv cov pob zeb granite nrog cov thermal expansion coefficient zoo ib yam li cov ntaub ntawv silicon tuaj yeem txo cov kev ntxhov siab thermal thiab ua kom muaj kev ruaj ntseg thiab raug ntawm cov txheej txheem etching thiab deposition. cov
Ntim theem: Thermal mismatch ua rau muaj teeb meem kev ntseeg tau
Nyob rau hauv lub semiconductor ntim theem, qhov sib xws ntawm thermal expansion coefficients ntawm cov nti thiab cov khoom ntim (xws li epoxy resin, ceramics, thiab lwm yam) yog qhov tseem ceeb. Lub thermal expansion coefficient ntawm silicon, cov khoom tseem ceeb ntawm cov chips, yog qhov tsawg, thaum cov khoom ntim feem ntau kuj siab. Thaum qhov kub ntawm cov nti hloov thaum siv, thermal stress yuav tshwm sim ntawm cov nti thiab cov khoom ntim vim qhov tsis sib haum ntawm thermal expansion coefficients. cov
Qhov kev ntxhov siab thermal no, nyob rau hauv qhov tshwm sim ntawm qhov kub thiab txias (xws li cua sov thiab cua txias thaum lub sijhawm ua haujlwm ntawm lub nti), tuaj yeem ua rau qaug zog tawg ntawm cov pob qij txha ntawm cov nti thiab cov ntim substrate, lossis ua rau cov xov hlau sib txuas ntawm cov nti nto ntog, thaum kawg ua rau qhov tsis ua haujlwm ntawm cov hluav taws xob sib txuas ntawm cov nti. Los ntawm kev xaiv cov khoom ntim khoom ntim nrog cov thermal expansion coefficient ze rau ntawm cov ntaub ntawv silicon thiab siv granite test platforms nrog thermal stability zoo rau kev tshawb pom qhov tseeb thaum lub sij hawm ntim cov txheej txheem, qhov teeb meem ntawm thermal mismatch yuav txo tau zoo, kev cia siab ntawm ntim tuaj yeem txhim kho, thiab kev pabcuam lub neej ntawm cov nti tuaj yeem ntev. cov
Kev tswj ib puag ncig ntau lawm: Kev sib koom ua ke ruaj khov ntawm cov cuab yeej siv thiab lub tsev tsim khoom
Ntxiv rau qhov cuam tshuam ncaj qha rau cov txheej txheem tsim khoom, cov coefficient ntawm thermal expansion kuj muaj feem xyuam rau tag nrho ib puag ncig tswj ntawm semiconductor factories. Hauv cov chaw ua haujlwm loj semiconductor ntau lawm, yam xws li kev pib thiab nres ntawm cov tshuab cua txias thiab cov cua kub dissipation ntawm cov khoom siv tuaj yeem ua rau muaj kev hloov pauv hauv ib puag ncig kub. Yog hais tias lub coefficient ntawm thermal expansion ntawm lub Hoobkas hauv pem teb, cov cuab yeej siv thiab lwm yam kev tsim kho siab dhau lawm, kev hloov pauv kub mus ntev yuav ua rau hauv pem teb tawg thiab cov khoom siv hauv paus hloov, yog li cuam tshuam rau qhov tseeb ntawm cov cuab yeej precision xws li photolithography tshuab thiab etching tshuab. cov
Los ntawm kev siv granite hauv paus raws li cov cuab yeej txhawb nqa thiab sib txuas nrog cov khoom siv hauv tsev nrog cov thermal expansion coefficients tsawg, qhov chaw tsim khoom ruaj khov tuaj yeem tsim, txo qhov zaus ntawm cov khoom siv calibration thiab tu cov nqi uas tshwm sim los ntawm ib puag ncig thermal deformation, thiab ua kom lub sij hawm ruaj khov ntawm cov khoom siv semiconductor. cov
Lub coefficient ntawm thermal expansion khiav los ntawm tag nrho lub neej voj voog ntawm semiconductor manufacturing, los ntawm cov khoom xaiv, txheej txheem tswj mus rau ntim thiab kuaj. Qhov cuam tshuam ntawm thermal expansion yuav tsum tau txiav txim siab nruj me ntsis hauv txhua qhov txuas. Granite hauv paus, nrog lawv cov coefficient ultra-low ntawm thermal expansion thiab lwm yam khoom zoo heev, muab lub hauv paus ruaj khov rau kev tsim khoom semiconductor thiab dhau los ua qhov tseem ceeb lav rau kev txhawb nqa kev tsim cov txheej txheem chips ntawm ntau dua precision.
Post lub sij hawm: May-20-2025