Hauv kev tsim khoom siv semiconductor, uas nrhiav kev ua kom raug qhov kawg, qhov coefficient ntawm thermal expansion yog ib qho ntawm cov yam ntxwv tseem ceeb uas cuam tshuam rau cov khoom zoo thiab kev ruaj khov ntawm kev tsim khoom. Thoob plaws hauv tag nrho cov txheej txheem los ntawm photolithography, etching mus rau ntim khoom, qhov sib txawv ntawm cov coefficients thermal expansion ntawm cov ntaub ntawv tuaj yeem cuam tshuam rau kev ua kom raug ntawm ntau txoj kev. Txawm li cas los xij, lub hauv paus granite, nrog nws cov coefficient thermal expansion qis heev, tau dhau los ua qhov tseem ceeb rau kev daws qhov teeb meem no.
Cov txheej txheem lithography: Thermal deformation ua rau muaj qhov sib txawv ntawm cov qauv
Kev thaij duab yog ib kauj ruam tseem ceeb hauv kev tsim khoom semiconductor. Los ntawm lub tshuab thaij duab, cov qauv hluav taws xob ntawm lub ntsej muag raug xa mus rau qhov chaw ntawm lub wafer uas tau coated nrog photoresist. Thaum lub sijhawm no, kev tswj hwm thermal hauv lub tshuab thaij duab thiab kev ruaj khov ntawm lub rooj ua haujlwm yog qhov tseem ceeb heev. Piv txwv li cov khoom siv hlau ib txwm muaj. Lawv cov coefficient ntawm thermal expansion yog kwv yees li 12 × 10⁻⁶ / ℃. Thaum lub sijhawm ua haujlwm ntawm lub tshuab thaij duab, cov cua sov tsim los ntawm lub teeb laser, cov iav kho qhov muag thiab cov khoom siv kho tshuab yuav ua rau qhov kub ntawm cov khoom siv nce 5-10 ℃. Yog tias lub tshuab thaij duab lub rooj ua haujlwm siv lub hauv paus hlau, lub hauv paus 1-meter-ntev yuav ua rau muaj kev hloov pauv ntawm 60-120 μm, uas yuav ua rau muaj kev hloov pauv hauv qhov chaw sib piv ntawm lub ntsej muag thiab lub wafer.
Hauv cov txheej txheem tsim khoom siab heev (xws li 3nm thiab 2nm), qhov sib nrug ntawm transistor tsuas yog ob peb nanometers xwb. Qhov kev hloov pauv me me ntawm thermal no txaus ua rau cov qauv photolithography tsis sib xws, ua rau muaj kev sib txuas transistor tsis zoo, luv luv lossis qhib circuits, thiab lwm yam teeb meem, ua rau cov haujlwm ntawm cov chip tsis ua haujlwm. Lub coefficient thermal expansion ntawm lub hauv paus granite yog qis li 0.01μm / ° C (piv txwv li, (1-2) × 10⁻⁶ / ℃), thiab qhov kev hloov pauv hauv qab qhov kub thiab txias tib yam tsuas yog 1 / 10-1 / 5 ntawm cov hlau. Nws tuaj yeem muab lub platform ruaj khov rau lub tshuab photolithography, ua kom ntseeg tau tias qhov kev hloov pauv ntawm cov qauv photolithography raug thiab txhim kho cov txiaj ntsig ntawm kev tsim khoom chip.
Kev khawb thiab kev tso tawm: Cuam tshuam rau qhov tseeb ntawm qhov qauv
Kev khawb thiab kev tso tawm yog cov txheej txheem tseem ceeb rau kev tsim cov qauv hluav taws xob peb-seem ntawm qhov chaw wafer. Thaum lub sijhawm ua cov txheej txheem khawb, cov roj reactive dhau los ua cov tshuaj lom neeg nrog cov khoom siv ntawm qhov chaw ntawm wafer. Lub caij no, cov khoom xws li lub zog fais fab RF thiab kev tswj cov roj ntws hauv cov khoom siv tsim cua sov, ua rau qhov kub ntawm wafer thiab cov khoom siv khoom nce siab. Yog tias qhov coefficient ntawm kev nthuav dav thermal ntawm lub wafer carrier lossis cov khoom siv hauv paus tsis phim qhov ntawm wafer (qhov coefficient ntawm kev nthuav dav thermal ntawm cov khoom siv silicon yog kwv yees li 2.6 × 10⁻⁶ / ℃), kev ntxhov siab thermal yuav tsim thaum qhov kub hloov pauv, uas yuav ua rau muaj cov kab nrib pleb me me lossis warping ntawm qhov chaw ntawm wafer.
Hom kev hloov pauv no yuav cuam tshuam rau qhov tob ntawm etching thiab qhov ntsug ntawm phab ntsa sab, ua rau qhov loj ntawm cov grooves etched, los ntawm qhov thiab lwm yam qauv kom tsis txhob raws li qhov yuav tsum tau tsim. Ib yam li ntawd, hauv cov txheej txheem tso zaj duab xis nyias, qhov sib txawv ntawm kev nthuav dav thermal yuav ua rau muaj kev ntxhov siab sab hauv hauv cov zaj duab xis nyias uas tau tso, ua rau muaj teeb meem xws li kev tawg thiab tev ntawm zaj duab xis, uas cuam tshuam rau kev ua haujlwm hluav taws xob thiab kev ntseeg siab mus sij hawm ntev ntawm cov chip. Kev siv cov hauv paus granite nrog cov coefficient nthuav dav thermal zoo ib yam li cov ntaub ntawv silicon tuaj yeem txo qhov kev ntxhov siab thermal thiab xyuas kom meej tias muaj kev ruaj khov thiab raug ntawm cov txheej txheem etching thiab deposition.
Theem Ntim Khoom: Kev tsis sib xws ntawm qhov kub thiab txias ua rau muaj teeb meem kev ntseeg siab
Hauv theem ntim khoom semiconductor, qhov sib xws ntawm cov coefficients thermal expansion ntawm cov chip thiab cov khoom ntim (xws li epoxy resin, ceramics, thiab lwm yam) yog qhov tseem ceeb heev. Cov coefficient thermal expansion ntawm silicon, cov khoom tseem ceeb ntawm cov chips, yog qhov tsawg, thaum feem ntau cov khoom ntim khoom yog qhov siab. Thaum qhov kub ntawm cov chip hloov pauv thaum siv, kev ntxhov siab thermal yuav tshwm sim ntawm cov chip thiab cov khoom ntim vim qhov tsis sib xws ntawm cov coefficients thermal expansion.
Qhov kev ntxhov siab thermal no, nyob rau hauv qhov cuam tshuam ntawm cov voj voog kub rov ua dua (xws li cua sov thiab txias thaum lub sijhawm ua haujlwm ntawm lub chip), tuaj yeem ua rau qaug zog tawg ntawm cov pob qij txha ntawm lub chip thiab lub substrate ntim, lossis ua rau cov xov hlau sib txuas ntawm qhov chaw ntawm lub chip poob tawm, thaum kawg ua rau kev sib txuas hluav taws xob ntawm lub chip tsis ua haujlwm. Los ntawm kev xaiv cov ntaub ntawv ntim khoom nrog cov coefficient thermal expansion ze rau cov ntaub ntawv silicon thiab siv cov platform kuaj granite nrog kev ruaj khov thermal zoo heev rau kev kuaj pom qhov tseeb thaum lub sijhawm ntim khoom, qhov teeb meem ntawm thermal mismatch tuaj yeem txo qis, kev ntseeg siab ntawm kev ntim khoom tuaj yeem txhim kho, thiab lub neej ua haujlwm ntawm lub chip tuaj yeem ntev dua.
Kev tswj hwm ib puag ncig ntawm kev tsim khoom: Kev ruaj khov ntawm cov khoom siv thiab cov tsev Hoobkas
Ntxiv rau qhov cuam tshuam ncaj qha rau cov txheej txheem tsim khoom, qhov coefficient ntawm thermal expansion kuj tseem muaj feem cuam tshuam nrog kev tswj hwm ib puag ncig ntawm cov chaw tsim khoom semiconductor. Hauv cov chaw ua haujlwm loj ntawm semiconductor, cov yam xws li qhov pib thiab nres ntawm cov tshuab cua txias thiab cov cua sov ntawm cov khoom siv tuaj yeem ua rau muaj kev hloov pauv ntawm qhov kub thiab txias ib puag ncig. Yog tias qhov coefficient ntawm thermal expansion ntawm lub Hoobkas pem teb, cov khoom siv hauv paus thiab lwm yam khoom siv siab dhau, kev hloov pauv kub mus sij hawm ntev yuav ua rau hauv pem teb tawg thiab lub hauv paus khoom siv hloov pauv, yog li cuam tshuam rau qhov tseeb ntawm cov khoom siv precision xws li cov tshuab photolithography thiab cov tshuab etching.
Los ntawm kev siv cov hauv paus granite ua cov khoom siv txhawb nqa thiab sib xyaw nrog cov khoom siv hauv tsev ua haujlwm nrog cov coefficients thermal expansion qis, ib puag ncig tsim khoom ruaj khov tuaj yeem tsim tau, txo qhov zaus ntawm kev kho cov khoom siv thiab cov nqi txij nkawm uas tshwm sim los ntawm kev hloov pauv thermal ib puag ncig, thiab ua kom ntseeg tau tias kev ua haujlwm ruaj khov mus sij hawm ntev ntawm cov kab ntau lawm semiconductor.
Tus coefficient ntawm thermal expansion khiav thoob plaws hauv lub neej ntawm kev tsim khoom semiconductor, los ntawm kev xaiv cov khoom siv, kev tswj cov txheej txheem mus rau kev ntim khoom thiab kev sim. Qhov cuam tshuam ntawm thermal expansion yuav tsum tau xav txog nruj me ntsis hauv txhua qhov txuas. Cov hauv paus granite, nrog lawv cov coefficient ultra-low ntawm thermal expansion thiab lwm yam khoom zoo heev, muab lub hauv paus ruaj khov rau kev tsim khoom semiconductor thiab dhau los ua qhov lav tseem ceeb rau kev txhawb nqa kev txhim kho cov txheej txheem tsim khoom chip mus rau qhov tseeb dua.
Lub sijhawm tshaj tawm: Tsib Hlis-20-2025