1. Dimensional raug
Flatness: qhov flatness ntawm qhov chaw ntawm lub hauv paus yuav tsum ncav cuag tus qauv siab heev, thiab qhov kev ua yuam kev flatness yuav tsum tsis pub tshaj ± 0.5μm hauv ib qho 100mm × 100mm cheeb tsam; Rau tag nrho lub hauv paus dav hlau, qhov kev ua yuam kev flatness yog tswj tsis pub dhau ± 1μm. Qhov no ua kom ntseeg tau tias cov khoom tseem ceeb ntawm cov khoom siv semiconductor, xws li lub taub hau ntawm cov khoom siv lithography thiab cov lus sojntsuam ntawm cov khoom siv tshuaj ntsuam xyuas, tuaj yeem txhim kho thiab ua haujlwm ntawm lub dav hlau high-precision, xyuas kom meej qhov tseeb ntawm txoj kev kho qhov muag thiab kev sib txuas ntawm cov khoom siv, thiab zam qhov sib txawv ntawm cov khoom sib txawv ntawm cov khoom siv los ntawm lub dav hlau tsis sib xws ntawm lub hauv paus ntawm lub hauv paus.
Straightness: Qhov ncaj ntawm txhua ntug ntawm lub hauv paus yog qhov tseem ceeb. Nyob rau hauv cov kev taw qhia ntawm qhov ntev, qhov ncaj ncaj yuam kev yuav tsum tsis pub tshaj ± 1μm ib 1m; Cov kab pheeb ces kaum ncaj ncaj yog tswj tsis pub dhau ± 1.5μm. Siv lub tshuab lithography high-precision lithography ua piv txwv, thaum lub rooj txav raws cov lus qhia ntawm lub hauv paus, qhov ncaj ntawm ntug ntawm lub hauv paus ncaj qha cuam tshuam rau qhov tseeb ntawm lub rooj. Yog hais tias qhov ncaj tsis yog raws li tus qauv, cov qauv lithography yuav raug cuam tshuam thiab deformed, uas ua rau txo qis ntawm cov nti tsim tawm.
Parallelism: Qhov kev ua yuam kev tsis sib xws ntawm sab sauv thiab sab qis ntawm lub hauv paus yuav tsum tswj tsis pub dhau ± 1μm. Kev sib luag zoo tuaj yeem ua kom muaj kev ruaj ntseg ntawm tag nrho qhov nruab nrab ntawm lub ntiajteb txawj nqus tom qab kev teeb tsa ntawm cov khoom siv, thiab lub zog ntawm txhua qhov sib xyaw ua ke. Hauv cov khoom siv hluav taws xob semiconductor wafer, yog tias qhov chaw sab sauv thiab sab qis ntawm lub hauv paus tsis sib npaug, lub wafer yuav qaij thaum ua, cuam tshuam cov txheej txheem sib xws xws li etching thiab txheej, thiab yog li cuam tshuam rau kev ua haujlwm ntawm cov nti.
Thib ob, cov yam ntxwv ntawm cov khoom
Hardness: Lub hardness ntawm granite hauv paus khoom yuav tsum ncav cuag ntug hardness HS70 los yog siab dua. Lub siab tawv tuaj yeem tiv taus qhov hnav los ntawm kev txav mus los thiab kev sib txhuam ntawm cov khoom siv thaum lub sijhawm ua haujlwm ntawm cov khoom siv, kom ntseeg tau tias lub hauv paus tuaj yeem tswj tau qhov siab precision loj tom qab siv mus ntev. Nyob rau hauv cov khoom ntim ntim, cov neeg hlau caj npab nquag rub thiab tso cov nti rau ntawm lub hauv paus, thiab lub siab hardness ntawm lub hauv paus tuaj yeem ua kom lub ntsej muag tsis yooj yim los tsim khawb thiab tswj qhov tseeb ntawm cov neeg hlau caj npab txav.
Qhov ceev: Cov khoom siv ntom ntom yuav tsum nyob nruab nrab ntawm 2.6-3.1 g / cm³. Qhov tsim nyog ntom ntom ua rau lub hauv paus muaj kev ruaj ntseg zoo, uas tuaj yeem ua kom muaj kev nruj txaus los txhawb cov cuab yeej siv, thiab yuav tsis muaj teeb meem rau kev teeb tsa thiab kev thauj mus los ntawm cov khoom siv vim hnyav hnyav. Hauv cov khoom siv tshuaj xyuas semiconductor loj, lub hauv paus ruaj khov pab txo qis kev vibration kis tau tus mob thaum lub sijhawm ua haujlwm ntawm cov cuab yeej siv thiab txhim kho kev tshawb pom qhov tseeb.
Thermal stability: linear expansion coefficient tsawg dua 5 × 10⁻⁶ / ℃. Cov khoom siv semiconductor yog qhov nkag siab zoo rau kev hloov pauv kub, thiab thermal stability ntawm lub hauv paus yog ncaj qha ntsig txog qhov tseeb ntawm cov khoom siv. Thaum lub sij hawm lithography txheej txheem, qhov kub hloov pauv tuaj yeem ua rau qhov nthuav dav lossis kev cog lus ntawm lub hauv paus, uas ua rau muaj qhov sib txawv ntawm qhov loj ntawm cov qauv raug. Lub hauv paus granite nrog qis linear expansion coefficient tuaj yeem tswj qhov kev hloov pauv loj hauv ntau qhov me me thaum qhov kev ua haujlwm kub ntawm cov khoom hloov pauv (feem ntau 20-30 ° C) kom ntseeg tau qhov tseeb lithography.
Peb, nto zoo
Roughness: Qhov saum npoo roughness Ra tus nqi ntawm lub hauv paus tsis tshaj 0.05μm. Lub ntsej muag ultra-ntxhiab tuaj yeem txo qhov adsorption ntawm plua plav thiab impurities thiab txo qhov cuam tshuam rau kev huv ntawm semiconductor nti tsim ib puag ncig. Nyob rau hauv lub rhiav tsis muaj plua plav ntawm chip manufacturing, cov khoom me me tuaj yeem ua rau muaj qhov tsis xws luag xws li luv luv Circuit Court ntawm cov nti, thiab cov npoo du ntawm lub hauv paus yuav pab kom muaj kev huv ntawm lub rhiav thiab txhim kho cov nti tawm los.
Microscopic defects: Qhov saum npoo ntawm lub hauv paus tsis raug tso cai kom muaj cov kab nrib pleb uas pom, xuab zeb qhov, pores thiab lwm yam tsis xws luag. Nyob rau theem microscopic, tus naj npawb ntawm qhov tsis xws luag nrog txoj kab uas hla ntau dua 1μm ib square centimeter yuav tsum tsis pub tshaj 3 los ntawm electron microscopy. Cov kev tsis zoo no yuav cuam tshuam rau lub zog ntawm cov qauv thiab qhov chaw tiaj tus ntawm lub hauv paus, thiab tom qab ntawd cuam tshuam rau kev ruaj ntseg thiab qhov tseeb ntawm cov khoom siv.
Plaub, stability thiab poob siab kuj
Dynamic stability: Nyob rau hauv lub simulated vibration ib puag ncig tsim los ntawm kev ua haujlwm ntawm cov khoom siv semiconductor (kev vibration zaus ntawm 10-1000Hz, amplitude 0.01-0.1mm), kev vibration hloov ntawm cov ntsiab lus tseem ceeb ntawm lub hauv paus yuav tsum tswj tsis pub dhau ± 0.05μm. Siv cov khoom siv kuaj semiconductor ua piv txwv, yog tias lub cuab yeej muaj kev vibration thiab ib puag ncig ib puag ncig kev co raug xa mus rau lub hauv paus thaum lub sijhawm ua haujlwm, qhov tseeb ntawm qhov ntsuas qhov ntsuas yuav cuam tshuam nrog. Zoo dynamic stability tuaj yeem ua kom ntseeg tau cov txiaj ntsig kev xeem.
Seismic tsis kam: Lub hauv paus yuav tsum muaj kev ua tau zoo ntawm seismic, thiab tuaj yeem txo lub zog vibration sai sai thaum nws raug rau sab nraud kev co (xws li seismic yoj simulation kev co), thiab xyuas kom meej tias qhov chaw txheeb ze ntawm cov khoom tseem ceeb ntawm cov khoom hloov hauv ± 0.1μm. Hauv cov chaw tsim khoom semiconductor hauv thaj chaw av qeeg, av qeeg-tiv taus hauv paus tuaj yeem tiv thaiv cov khoom siv hluav taws xob kim kim, txo cov kev pheej hmoo ntawm cov khoom puas tsuaj thiab kev cuam tshuam ntau lawm vim kev co.
5. Tshuaj stability
Corrosion resistance: Lub hauv paus granite yuav tsum tiv taus corrosion ntawm cov tshuaj lom neeg hauv cov txheej txheem tsim khoom semiconductor, xws li hydrofluoric acid, aqua regia, thiab lwm yam. Tom qab soaking nyob rau hauv hydrofluoric acid tov nrog loj feem ntawm 40% rau 24 teev, qhov nto zoo poob tus nqi yuav tsum tsis txhob ntau tshaj 0.01%; Soak hauv aqua regia (qhov piv ntawm hydrochloric acid rau nitric acid 3: 1) rau 12 teev, thiab tsis muaj qhov pom tseeb ntawm corrosion ntawm qhov chaw. Cov txheej txheem tsim khoom semiconductor suav nrog ntau yam tshuaj etching thiab tu cov txheej txheem, thiab kev txhim kho corrosion zoo ntawm lub hauv paus tuaj yeem ua kom ntseeg tau tias kev siv mus sij hawm ntev hauv cov tshuaj ib puag ncig tsis yog eroded, thiab qhov tseeb thiab kev ntseeg ruaj khov.
Anti-pollution: Cov khoom siv hauv paus muaj qhov nqus tsis zoo ntawm cov pa phem hauv qhov chaw tsim khoom semiconductor, xws li cov pa roj carbon monoxide, hlau ions, thiab lwm yam. Thaum muab tso rau hauv ib puag ncig uas muaj 10 PPM ntawm cov organic gases (xws li benzene, toluene) thiab 1ppm ntawm cov hlau ions (xws li, tooj liab ions, hlau ions, thiab lwm yam). tsis tsim nyog. Qhov no tiv thaiv cov kab mob los ntawm kev tsiv tawm ntawm lub hauv paus nto mus rau qhov chaw tsim khoom chip thiab cuam tshuam rau cov nti zoo.
Lub sij hawm xa tuaj: Mar-28-2025